DESO Technology Limited (Hong Kong) Silicon Wafers
DESO offers 12 inches diameter Prime Grade Silicon (Si) wafers, thickness 775 +/- 15 mm.
N-type and P-type are available. These wafers provide exceptional yield and superior quality.
As Si wafer size increases, the requirements to critical process parameters also become more stringent, including: oxygen content, radial uniformity of oxygen in wafer, impurity control, etc. Criteria for other parameter such as defect control, oxygen percipitation control, resistance quantification, doping, and radial uniformity are also tightened. As for prime 12 inches diameter Si wafers, TTV below 1.5 um and defect density ~ 0/cm^2 are typical criteria.
Product Specifications
Parameter |
Value |
Type of ingot |
Grown according to Czochralski method |
Diameter, mm |
300 +/- 0.2 |
Dopant |
B (boron) |
Conductivity type |
P |
Oxigen max, OLD – PPMA |
40 |
Carbon, PPMA |
1 |
Crystallographic orientation |
<100> |
Deviation from the predetermined surface orientation of crystal plane, degrees |
1 |
Volume resistivity, Ohm * cm |
8-12 |
Primary Notch |
Yes |
Notch location |
110 |
Notch size, mm |
2.3 |
Notch Form |
V |
Wafer thickness, microns |
775 +/- 15 |
Type of marking |
Laser |
Marking Location |
back side |
Edge profile |
by SEMI T/4 |
Scratches on the front side |
absent |
Front side polishing |
yes |
side polishing |
yes |
Total change in wafer thickness (TTV), micrometers |
1.5 |
Deflection (WARP), microns |
30 |
The number of particles on a surface larger than 0.09 microns |
30 |
Surface content of aluminum, E10AT/CM2 |
1 |
Surface content of calcium, E10AT/CM2 |
1 |
Surface content of chromium, E10AT/CM2 |
1 |
Surface content of copper, E10AT/CM2 |
1 |
Surface content of iron, E10AT/CM2 |
1 |
Surface content of potassium, E10AT/CM2 |
1 |
Surface content of natrium, E10AT/CM2 |
1 |
Surface content of nickel, E10AT/CM2 |
1 |
Surface content of zinc, E10AT/CM2 |
1 |
Packing Requirements:
| Parameter | Value |
| Type of Packaging | MW300GT-A |
| Inner Container Material | Polyethylene |
| Outer Packing Material | Aluminum |
| Number of units per packages | 25 |
| Reusability | Yes |
For quotations and questions please contact: Admin@WafersUnlimited.com