Germanium wafers

DESO Technology Limited (Hong Kong) Germanium Wafers

DESO Germanium (Ge) wafers are offered in diameters of 2, 3, 4 and 6 inches.

Ge wafers are grown using VGF/LEC method. Lightly doped P and N type Ge wafers may be used for Hall effect experiments. Ge serves as a semicondutor. High-purity Germanium is doped with trivalent elements (e.g. indium, gallium, boron) to construct P-type Ge semicondutors; and doped with pentavalent elements (e.g. antimony, arsenic, phosphorus) to construct N-type Ge semiconductors. Germanium has excellent semiconductor properties including high electron mobility and mole mobility.

Product Specifications

General Properties Structure

Cubic, a=5.6754 Angstrom
Density: 5.765 g/cm^3
Melting Point: 937.4 degrees Celsius
Thermal Conductivity: 640

Crystal Growth Technology: Czechrolaski

Doping Available

None

Sb Doping

Doping In / Ga

Conductive Type

N

N

P

Resistivity, Ohm*cm

>35

<0.05

0.05 – 0.1

EPD, max.

<5 x 10^3 /cm^2

<5 x 10^3 /cm^2

<5 x 10^3 /cm^2

EPD, min.

<5 x 10^2 /cm^2

<5 x 10^2 /cm^2

<5 x 10^2 /cm^2

Grade

Application

Electronic

Diodes and Transistors

Infrared or Optical

Cell

Parameter

Specification

Comment

Growth Method

VGF

Conduction Type

n-type,
p-type

Dopant

Gallium or Antimony

Wafer Diameter

2, 3, 4, 6

inches

Crystal Orientation

(100),(111),(110)

Thickness

200 – 550

um

OF

EJ or US

Carrier Concentration

upon customer request

Resistivity at RT

0.001 – 80

Ohm*cm

Pit Density

<5000

/cm^2

Laser marking

upon request

Surface finish

P/E or P/P

Epi ready

Yes

Package

Single wafer container or cassette

For quotations and questions please contact: Admin@WafersUnlimited.com

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